M24C08 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M24C08' PDF : 29 Pages View PDF
M24C16, M24C08, M24C04, M24C02, M24C01
Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline
D
E
A
A1
L3
ddd
e
b
L1
E2
L
D2
UFDFPN-01
Note: 1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be allowed to be connected to
any other voltage or signal line on the PCB, for example during the soldering process.
Table 20. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data
Symbol
Typ.
mm
Min.
Max.
Typ.
inches
Min.
Max.
A
0.55
0.50
0.60
0.022
0.020
0.024
A1
0.00
0.05
0.000
0.002
b
0.25
0.20
0.30
0.010
0.008
0.012
D
2.00
0.079
D2
1.55
1.65
0.061
0.065
ddd
0.05
0.002
E
3.00
0.118
E2
0.15
0.25
0.006
0.010
e
0.50
–
–
0.020
–
–
L
0.45
0.40
0.50
0.018
0.016
0.020
L1
0.15
0.006
L3
0.30
0.012
N
8
8
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