Revision history
13 Revision history
M25P64
Table 18. Document revision history
Date
Revision
Changes
28-Apr-2003 0.1 Target Specification Document written in brief form
15-May-2003 0.2 Target Specification Document written in full
20-Jun-2003 0.3 8x6 MLP8 and SO16(300 mil) packages added
18-Jul-2003
0.4 tPP, tSE and tBE revised
02-Sep-2003 0.5 Voltage supply range changed
19-Sep-2003
0.6
Table of contents, warning about exposed paddle on MLP8, and Pb-free
options added
17-Dec-2003
0.7
Value of tVSL(min) VWI, tPP(typ) and tBE(typ) changed. MLP8 package
removed.
15-Nov-2004
1.0
Document status promoted from Target Specification to Preliminary Data.
8x6 MLP8 package added. Minor wording changes.
Deep Power-Down mode removed from datasheet (Figure 18: Read
Electronic Signature (RES) instruction sequence and data-out sequence
24-Feb-2005
2.0
modified and tRES1 and tRES2 removed from Table 14: AC
characteristics). SO16 Wide package specifications updated. End timing
line of tSHQZ modified in Figure 24: Output timing. Figures moved below
the corresponding instructions in the Instructions section.
Updated Page Program (PP) instructions in Page Programming, Page
Program (PP) and Table 14: AC characteristics.
Fast Program/Erase mode added and Power-up specified for Fast
Program/Erase mode in Power-up and Power-down section. W pin
changed to W/VPP. (see Write Protect/Enhanced Program supply voltage
23-Dec-2005
3.0
(W/VPP) description). Note 2 inserted below Figure 26 Blank option
removed under Plating Technology.
tVPPHSL added to Table 14: AC characteristics and Figure 25: VPPH timing
inserted.
All packages are ECOPACK® compliant.
Document status promoted from Preliminary Data to full Datasheet
status.
16-Feb-2006
4.0
VDFPN8 (MLP8) package specifications updated (see Section 11:
Package mechanical).
Figure 4: Bus master and memory devices on the SPI bus modified.
07-Sep-2006
5
ICC1 maximum value updated in Table 13: DC characteristics.
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