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M36DR432-ZAT View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
'M36DR432-ZAT' PDF : 46 Pages View PDF
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M36DR432A, M36DR432B
Table 34. Ordering Information Scheme
Example:
M36DR432A
Device Type
M36 = MMP (Flash + SRAM)
Architecture
D = Dual Bank, Page Mode
Operating Voltage
R = VDDF = VDDS =1.65V to 2.2V
SRAM Chip Size & Organization
4 = 4 Mbit (256K x 16 bit)
Device Function
32A = 32 Mbit (x16), Dual Bank: 1/8-7/8 partitioning, Top Boot
32B = 32 Mbit (x16), Dual Bank: 1/8-7/8 partitioning, Bottom Boot
Speed
100 = 100ns
120 = 120ns
Package
ZA = LFBGA66: 0.8mm pitch
Temperature Range
6 = –40 to 85°C
Option
T = Tape & Reel packing
C = Cypress’s SRAM
100 ZA 6 T
Devices are shipped from the factory with the memory content bits erased to ’1’.
Table 35. Daisy Chain Ordering Scheme
Example:
M36DR432
-ZA T
Device Type
M36DR432
Daisy Chain
-ZA = LFBGA66: 0.8mm pitch
Option
T = Tape & Reel Packing
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the STMicroelectronics Sales Office nearest to you.
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