M40Z300MH6 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M40Z300MH6' PDF : 21 Pages View PDF
M40Z300, M40Z300W
Table 7. Power Down/Up Mode AC Characteristics
Symbol
Parameter(1)
Min
Max
Unit
tF(2)
VPFD (max) to VPFD (min) VCC Fall Time
300
µs
M40Z300
10
µs
tFB(3)
VPFD (min) to VSS VCC Fall Time
M40Z300W
150
µs
tR
VPFD(min) to VPFD (max) VCC Rise Time
10
µs
tEDL
Chip Enable Propagation Delay Low
M40Z300
M40Z300W
12
ns
20
ns
tEDH
Chip Enable Propagation Delay High
M40Z300
M40Z300W
10
ns
20
ns
tAS
A, B set up to E
0
ns
tCER
Chip Enable Recovery
40
120
ms
tREC(4) VPFD (max) to RST High
40
120
ms
tWPT
Write Protect Time
M40Z300
40
M40Z300W
40
150
µs
250
µs
tRB
VSS to VPFD (min) VCC Rise Time
1
µs
Note: 1. Valid for Ambient Operating Temperature: TA = 0 to 70°C or –40 to 85°C; VCC = 2.7 to 3.6V or 4.5 to 5.5V(except where noted).
2. VPFD (max) to VPFD (min) fall time of less than tF may result in deselection/write protection not occurring until 200 µs after VCC
passes VPFD (min).
3. VPFD (min) to VSS fall time of less than tFB may cause corruption of RAM data.
4. tREC (min) = 20ms for industrial temperature Grade 6 device.
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