Revision history
12 Revision history
M95320-W M95320-R M95320-DR
Table 23. Document revision history
Date
Revision
Changes
13-Jul-2000
Human Body Model meets JEDEC std (Table 2). Minor adjustments on pp
1.2 1,11,15. New clause on p7. Addition of TSSOP8 package on pp 1, 2,
Ordering Info, Mechanical Data
Test condition added ILI and ILO, and specification of tDLDH and tDHDL
removed.
tCLCH, tCHCL, tDLDH and tDHDL changed to 50ns for the -V range.
“-V” Voltage range changed to “2.7V to 3.6V” throughout.
16-Mar-2001 1.3 Maximum lead soldering time and temperature conditions updated.
Instruction sequence illustrations updated.
“Bus Master and Memory Devices on the SPI bus” illustration updated.
Package Mechanical data updated
19-Jul-2001 1.4 M95160 and M95080 devices removed to their own data sheet
Endurance increased to 1M write/erase cycles
06-Dec-2001 1.5
Instruction sequence illustrations updated
18-Dec-2001 2.0 Document reformatted using the new template. No parameters changed.
08-Feb-2002
Announcement made of planned upgrade to 10MHz clock for the 5V, –40
2.1 to 85°C, range.
Endurance set to 100K write/erase cycles
10MHz, 5MHz, 2MHz clock; 5ms, 10ms Write Time; 100K, 1M erase/write
18-Dec-2002 2.2 cycles distinguished on front page, and in the DC and AC Characteristics
tables
26-Mar-2003
2.3
Process identification letter corrected in footnote to AC Characteristics
table for temp. range 3
26-Jun-2003
2.4
-S voltage range upgraded by removing it and inserting -R voltage range
in its place
15-Oct-2003 3.0 Table of contents, and Pb-free options added. VIL(min) improved to -0.45V
21-Nov-2003 3.1 VI(min) and VO(min) corrected (improved) to -0.45V
28-Jan-2004 4.0 TSSOP8 connections added to DIP and SO connections
M95320-S and M95640-S root part numbers (1.65 to 5.5V Supply) and
related characteristics added.
20MHz Clock rate added.TSSOP14 package removed and MLP8 package
added.
Description of Power On Reset: VCC Lock-Out Write Protect updated.
24-May-2005 5.0 Product List summary table added. Absolute Maximum Ratings for
VIO(min) and VCC(min) improved. Soldering temperature information
clarified for RoHS compliant devices. Device Grade 3 clarified, with
reference to HRCF and automotive environments. AEC-Q100-002
compliance. tCHHL(min) and tCHHH(min) is tCH for products under “S”
process. tHHQX corrected to tHHQV.
Figure 20: Hold timing updated.
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Doc ID 5711 Rev 14