M95512-DR View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M95512-DR' PDF : 48 Pages View PDF
Package mechanical data
M95512-W, M95512-R
Figure 24. TSSOP8 – 8 lead thin shrink small outline, package outline
D
8
5
c
E1 E
1
4
α
A
CP
A1
L
A2
L1
b
e
TSSOP8AM
1. Drawing is not to scale.
2. The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be
connected to any other voltage or signal line on the PCB, for example during the soldering process.
Table 20.
Symbol
TSSOP8 – 8 lead thin shrink small outline, package mechanical data
millimeters
inches(1)
Typ
Min
Max
Typ
Min
Max
A
1.200
0.0472
A1
0.050
0.150
0.0020
0.0059
A2
1.000
0.800
1.050
0.0394
0.0315
0.0413
b
0.190
0.300
0.0075
0.0118
c
0.090
0.200
0.0035
0.0079
CP
0.100
0.0039
D
3.000
2.900
3.100
0.1181
0.1142
0.1220
e
0.650
–
–
0.0256
–
–
E
6.400
6.200
6.600
0.2520
0.2441
0.2598
E1
4.400
4.300
4.500
0.1732
0.1693
0.1772
L
0.600
0.450
0.750
0.0236
0.0177
0.0295
L1
1.000
0.0394
0°
8°
0°
8°
N
8
8
1. Values in inches are converted from mm and rounded to 4 decimal digits.
40/48
Doc ID 11124 Rev 13
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