PACKAGE (WL-CSP) OUTLINE
All dimensions in microns, drawings not to scale.
1400 (-50 +0)
DA9123.007
3 May 2004
500 ± 5
BOTTOM VIEW
200 ± 20
890 (-50 +0)
BACKSIDE MARKING
Pin A1 designator
23XY
500 ± 5
100-150
Coplanarity across chipsite (die) ≤ 10
480 ± 25
Definitions (see ordering information p. 12):
X = Package option
Y = Output voltage option
10 (12)