MC9S08QB4 View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
MFG CO.
'MC9S08QB4' PDF : 36 Pages View PDF
4 Ordering Information
This section contains ordering information for the device numbering system.
Example of the device numbering system:
MC 9 S08 QB 8 C XX
Ordering Information
Status
(MC = Fully Qualified)
Memory
(9 = Flash-based)
Core
Family
Package designator (see Table 18)
Temperature range
(C = –40 °C to 85 °C)
Approximate flash size in KB
5 Package Information
Table 18. Package Descriptions
Pin Count
28
24
16
Package Type
Small Outline Integrated Circuit
Quad Flat Non-Leaded
Thin Shrink Small Outline Package
Abbreviation
SOIC
QFN
TSSOP
Designator
WL
GK
TG
Case No.
751F
1982-01
948F
Document No.
98ASB42345B
98ARL10608D
98ASH70247A
5.1 Mechanical Drawings
The following pages are mechanical drawings for the packages described in Table 18.
MC9S08QB8 Series MCU Data Sheet, Rev. 3
Freescale Semiconductor
25
Share Link: 
