MC9S08SF4 View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
MFG CO.
'MC9S08SF4' PDF : 32 Pages View PDF
4 Ordering Information
This section contains ordering information for device numbering system
Example of the device numbering system:
MC 9 S08 SF 4 X XX
Mechanical Drawings
Status
(MC = Fully Qualified)
Memory
(9 = Flash-based)
Core
Family
Package designator (see Table 14)
Temperature range
(M= –40°C to 125°C)
(V = –40°C to 105°C)
(C = –40°C to 85°C)
Approximate flash size in kbytes
5 Package Information
Table 14. Package Descriptions
Pin Count
20
16
Package Type
Thin Shrink Small Outline Package
Thin Shrink Small Outline Package
Abbreviation
TSSOP
TSSOP
Designator
TJ
TG
Case No.
948E
948F
Document No.
98ASH70169A
98ASH70247A
5.1 Mechanical Drawings
The following pages are mechanical drawings for the packages described in Table 14. For the latest
available drawings, please visit our web site (http://www.freescale.com) and enter the package’s document
number into the keyword search box.
MC9S08SF4 Series MCU Data Sheet, Rev. 2
Freescale Semiconductor
23
Share Link: 
