MC9S12A32 View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

MFG CO.

MC9S12A32

MC9S12DJ64 Device User Guide V01.20

Freescale Semiconductor 

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MC9S12DJ64 Device User Guide — V01.20

Table A-5 Thermal Package Characteristics1

Num C

Rating

Symbol Min

Typ

1 T Thermal Resistance LQFP112, single sided PCB2

θJA

–

–

Thermal Resistance LQFP112, double sided PCB

2 T with 2 internal planes3

θJA

–

–

3 T Junction to Board LQFP112

θJB

–

–

4 T Junction to Case LQFP112

θJC

–

–

5 T Junction to Package Top LQFP112

ΨJT

–

–

6 T Thermal Resistance QFP 80, single sided PCB

θJA

–

–

7

T

Thermal Resistance QFP 80, double sided PCB with

2 internal planes

θJA

–

–

8 T Junction to Board QFP80

θJB

–

–

9 T Junction to Case QFP80

θJC

–

–

10 T Junction to Package Top QFP80

ΨJT

–

–

NOTES:

1. The values for thermal resistance are achieved by package simulations

2. PC Board according to EIA/JEDEC Standard 51-3

3. PC Board according to EIA/JEDEC Standard 51-7

Max

54

41

31

11

2

51

41

27

14

3

Unit

oC/W

oC/W

oC/W

oC/W

oC/W

oC/W

oC/W

oC/W

oC/W

oC/W

A.1.9 I/O Characteristics

This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g.

not all pins feature pull up/down resistances.

93

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