MC9S12DG128 View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
MFG CO.
'MC9S12DG128' PDF : 142 Pages View PDF
Device User Guide — 9S12DT128DGV2/D V02.16
calculations refer to Section A.1.8 Power Dissipation and Thermal
Characteristics.
Table A-4 Operating Conditions
Rating
Symbol
Min
Typ
Max Unit
I/O, Regulator and Analog Supply Voltage
VDD5
4.5
5
5.25
V
Digital Logic Supply Voltage 1
VDD
2.35
2.5
2.75
V
PLL Supply Voltage 1
VDDPLL
2.25
2.5
2.75
V
Voltage Difference VDDX to VDDR and VDDA
∆VDDX
-0.1
0
0.1
V
Voltage Difference VSSX to VSSR and VSSA
∆VSSX
-0.1
0
0.1
V
Bus Frequency
fbus
0.252
-
25
MHz
MC9S12DT128C
Operating Junction Temperature Range
T
J
-40
-
100
°C
Operating Ambient Temperature Range 3
T
A
-40
27
85
°C
MC9S12DT128V
Operating Junction Temperature Range
TJ
-40
-
120
°C
Operating Ambient Temperature Range 3
TA
-40
27
105
°C
MC9S12DT128M
Operating Junction Temperature Range
TJ
-40
-
140
°C
Operating Ambient Temperature Range 3
TA
-40
27
125
°C
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
given operating range applies when this regulator is disabled and the device is powered from an external source.
2. Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper oper-
ation.
3. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the rela-
tion between ambient temperature TA and device junction temperature TJ.
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (TJ) in °C can be
obtained from:
TJ = TA + (PD • ΘJA)
TJ = Junction Temperature, [°C ]
TA = Ambient Temperature, [°C ]
Freescale Semiconductor
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