MCP1726 View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
'MCP1726' PDF : 30 Pages View PDF
MCP1726
8-Lead Plastic Dual Flat, No Lead Package (MF) – 3x3x0.9 mm Body [DFN]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
NOTE 1
12
TOP VIEW
EXPOSED PAD
E
K
e
b
N
L
E2
21
D2
BOTTOM VIEW
NOTE 1
A
NOTE 2
A3
A1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
0.65 BSC
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
3.00 BSC
Exposed Pad Width
E2
0.00
–
1.60
Overall Width
E
3.00 BSC
Exposed Pad Length
D2
0.00
–
2.40
Contact Width
b
0.25
0.30
0.35
Contact Length
L
0.20
0.30
0.55
Contact-to-Exposed Pad
K
0.20
–
–
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-062B
DS21936C-page 22
© 2007 Microchip Technology Inc.
Share Link: 
