MCP3906T-I/SS View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
'MCP3906T-I/SS' PDF : 26 Pages View PDF
24-Lead Plastic Shrink Small Outline (SS) (SSOP)
E
p
E1
MCP3905/06
B
n
D
2
1
A
c
φ
A2
A1
L
Units
INCHES
MILLIMETERS*
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
24
p
.026 BSC.
24
0.65 BSC.
Overall Height
A
.068
.073
.078
1.73
1.86
1.99
Molded Package Thickness
A2
.066
.068
.070
1.68
1.73
1.78
Standoff
A1
.002
.005
.008
0.05
0.13
0.21
Overall Width
E
.301
.307
.311
7.65
7.80
7.90
Molded Package Width
E1
.205
.209
.212
5.20
5.30
5.38
Overall Length
D
.318
.323
.328
8.07
8.20
8.33
Foot Length
L
.025
.030
.037
0.63
0.75
0.95
Lead Thickness
Foot Angle
c
.004
.006
–
0.09
0.15
–
φ
0°
4°
8°
0°
4°
8°
Lead Width
B
.010
–
.015
0.25
–
0.38
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5M
JEDEC Equivalent: MO-150
Drawing No. C04-132
Revised 9-14-05
© 2005 Microchip Technology Inc.
DS21948C-page 19
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