ML9209-XXGA View Datasheet(PDF) - LAPIS Semiconductor Co., Ltd.
Part Name
Description
MFG CO.
'ML9209-XXGA' PDF : 29 Pages View PDF
LAPIS Semiconductor
PACKAGE DIMENSIONS
QFP44-P-910-0.80-2K
FEDL9209-01
ML9209-xx
(Unit: mm)
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Sn/Pb
0.41 TYP.
5/Nov. 20, 2002
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions (reflow
method, temperature and times).
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