MPC5644B View Datasheet(PDF) - Freescale Semiconductor
Part Name
Description
MFG CO.
'MPC5644B' PDF : 114 Pages View PDF
Table of Contents
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 Document Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
3 Package pinouts and signal descriptions . . . . . . . . . . . . . . . . .9
3.1 Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
3.2 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
3.3 Functional ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
4.1 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . .39
4.2 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
4.2.1 NVUSRO [PAD3V5V(0)] field description . . . . .40
4.2.2 NVUSRO [PAD3V5V(1)] field description . . . . .40
4.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . .40
4.4 Recommended operating conditions . . . . . . . . . . . . . .42
4.5 Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . .45
4.5.1 Package thermal characteristics . . . . . . . . . . . .45
4.5.2 Power considerations. . . . . . . . . . . . . . . . . . . . .45
4.6 I/O pad electrical characteristics . . . . . . . . . . . . . . . . . .46
4.6.1 I/O pad types . . . . . . . . . . . . . . . . . . . . . . . . . . .46
4.6.2 I/O input DC characteristics . . . . . . . . . . . . . . . .46
4.6.3 I/O output DC characteristics. . . . . . . . . . . . . . .47
4.6.4 Output pin transition times . . . . . . . . . . . . . . . . .50
4.6.5 I/O pad current specification . . . . . . . . . . . . . . .51
4.7 RESET electrical characteristics. . . . . . . . . . . . . . . . . .53
4.8 Power management electrical characteristics. . . . . . . .55
4.8.1 Voltage regulator electrical characteristics . . . .55
4.8.2 VDD_BV options . . . . . . . . . . . . . . . . . . . . . . . .56
4.8.3 Voltage monitor electrical characteristics. . . . . .57
4.9 Low voltage domain power consumption . . . . . . . . . . .58
4.10 Flash memory electrical characteristics . . . . . . . . . . . .60
4.10.1 Program/Erase characteristics. . . . . . . . . . . . . .60
4.10.2 Flash memory power supply DC characteristics62
4.10.3 Flash memory start-up/switch-off timings . . . . .63
4.11 Electromagnetic compatibility (EMC) characteristics . .63
4.11.1 Designing hardened software to avoid noise
problems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.11.2 Electromagnetic interference (EMI) . . . . . . . . . 64
4.11.3 Absolute maximum ratings (electrical sensitivity)64
4.12 Fast external crystal oscillator (4–40 MHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
4.13 Slow external crystal oscillator (32 kHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
4.14 FMPLL electrical characteristics . . . . . . . . . . . . . . . . . 70
4.15 Fast internal RC oscillator (16 MHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
4.16 Slow internal RC oscillator (128 kHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
4.17 ADC electrical characteristics . . . . . . . . . . . . . . . . . . . 72
4.17.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
4.18 Fast Ethernet Controller . . . . . . . . . . . . . . . . . . . . . . . 82
4.18.1 MII Receive Signal Timing (RXD[3:0], RX_DV,
RX_ER, and RX_CLK) . . . . . . . . . . . . . . . . . . . 82
4.18.2 MII Transmit Signal Timing (TXD[3:0], TX_EN,
TX_ER, TX_CLK) . . . . . . . . . . . . . . . . . . . . . . . 83
4.18.3 MII Async Inputs Signal Timing (CRS and COL)84
4.18.4 MII Serial Management Channel Timing (MDIO and
MDC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
4.19 On-chip peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
4.19.1 Current consumption . . . . . . . . . . . . . . . . . . . . 86
4.19.2 DSPI characteristics. . . . . . . . . . . . . . . . . . . . . 88
4.19.3 Nexus characteristics . . . . . . . . . . . . . . . . . . . . 96
4.19.4 JTAG characteristics. . . . . . . . . . . . . . . . . . . . . 98
5 Package characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
5.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . 100
5.1.1 176 LQFP package mechanical drawing . . . . 100
5.1.2 208 LQFP package mechanical drawing . . . . 103
5.1.3 256 MAPBGA package mechanical drawing . 108
6 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
MPC5646C Microcontroller Data Sheet, Rev. 3
2
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
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