MPC8349 View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

MFG CO.

MPC8349

PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications

Freescale Semiconductor 

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Package and Pin Listings

18 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8349E is available in

a tape ball grid array (TBGA). See Section 18.1, “Package Parameters for the MPC8349E TBGA” and

Section 18.2, “Mechanical Dimensions for the MPC8349E TBGA.”

18.1 Package Parameters for the MPC8349E TBGA

The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape

ball grid array (TBGA).

Package outline

35 mm × 35 mm

Interconnects

672

Pitch

1.00 mm

Module height (typical)

1.46 mm

Solder balls

62 Sn/36 Pb/2 Ag (ZU package)

95.5 Sn/0.5 Cu/4Ag (VV package)

Ball diameter (typical)

0.64 mm

MPC8349E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10

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Freescale Semiconductor

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