Thermal
TJ = TC + (RθJC × PD)
where:
TJ = junction temperature (°C)
TC = case temperature of the package (°C)
RθJC = junction-to-case thermal resistance (°C/W)
PD = power dissipation (W)
MPC8349E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10
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Freescale Semiconductor