MR20H40 / MR25H40
PACKAGE OUTLINE DRAWINGS
Figure 17 – DFN Package Outline
Exposed metal Pad. Do not
connect anything except VSS
A
5
8
B
Pin 1 Index
C
Detail A
DAP Size
4.4 x 4.4
J
I
G
M
4
F
K
L
H
1
N
D
E
Detail A
Dimension A
BCD
E
F
G
H
I
J
K
L
MN
Max.
Min.
5.10
4.90
6.10 1.00 1.27
5.90 0.90 BSC
0.45
0.35
0.05 0.35
0.00 Ref.
0.70
0.50
4.20
4.00
4.20
4.00
0.261
0.05
C0.35 R0.20
0.195
0.00
Notes:
1. Reference JEDEC MO-229.
2. All dimensions are in mm. Angles in degrees.
3. Coplanarity applies to the exposed pad as well as the terminals. Coplanarity shall be within 0.08 mm.
4. Warpage shall not exceed 0.10 mm.
Copyright © Everspin Technologies 2014
25
MR20H40 / MR25H40 Revision 11, 8/2014