MSC7110-01 View Datasheet(PDF) - Oki Electric Industry
Part Name
Description
MFG CO.
MSC7110-01
Oki Electric Industry
'MSC7110-01' PDF : 18 Pages View PDF
¡ Semiconductor
QFP44-P-910-0.80-2K
FEDL7110-03
MSC7110-01/7112-01
(Unit : mm)
Mirror finish
Oki Electric Industry Co., Ltd.
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Notes for Mounting the Surface Mount Type Package
Epoxy resin
42 alloy
Solder plating (≥5 mm)
0.41 TYP.
4/ Nov. 28, 1996
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
17/18
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