MSM63V89C View Datasheet(PDF) - Oki Electric Industry
Part Name
Description
MFG CO.
'MSM63V89C' PDF : 11 Pages View PDF
¡ Semiconductor
PACKAGE DIMENSIONS
TSOPII26/20-P-300-1.27-K
MSM63V89C
(Unit : mm)
Mirror finish
Notes for Mounting the Surface Mount Type Package
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.38 TYP.
The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
10/10
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