MSM6882-3GS-K View Datasheet(PDF) - Oki Electric Industry
Part Name
Description
MFG CO.
'MSM6882-3GS-K' PDF : 15 Pages View PDF
¡ Semiconductor
PACKAGE DIMENSIONS
DIP22-P-400-2.54
MSM6882-3/6882-5
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.90 TYP.
14/15
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