MT28F320J3RG-12F View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT28F320J3RG-12F' PDF : 52 Pages View PDF
0.850 ±0.075
SEATING PLANE
C
0.08 C
BALL A8
64X ∅0.45
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.40
7.00
1.00 TYP
7.00 ±0.05
3.50 ±0.05
64-BALL FBGA
128Mb, 64Mb, 32Mb
Q-FLASH MEMORY
BALL A1 ID
BALL A1
1.20 MAX
1.00 TYP
CL
13.00 ±0.10
6.50 ±0.05
BALL A1 ID
CL
3.50 ±0.05
5.50 ±0.05
10.00 ±0.10
NOTE: 1. All dimensions in millimeters.
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .33mm
DATA SHEET DESIGNATIONS
Preliminary: This data sheet contains initial characterization limits that are subject to change upon full
characterization of production devices. This designation applies to the MT28F320J3 and MT28F128J3
devices.
No Marking: This data sheet contains minimum and maximum limits specified over the complete power supply
and temperature range for production devices. Although considered final, these specifications are
subject to change, as further product development and data characterization sometimes occur. This
designation applies to the MT28F640J3 device.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron, the Micron and M logos and Q-Flash are trademarks and/or servicemarks of Micron Technology, Inc.
128Mb, 64Mb, 32Mb Q-Flash Memory
MT28F640J3_7.p65 – Rev. 6, Pub. 8/02
51
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
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