64Mb: x32
DDR SDRAM
PIN DESCRIPTIONS (continued)
TQFP PIN NUMBERS
94
37-44
87-90
91
93
2, 8, 14, 22, 59, 67, 73,
79, 86, 95
5, 11, 19, 62, 70, 76,
82, 92, 99
15, 35, 65, 96
16, 46, 66, 85
58
SYMBOL TYPE
DQS
I/O
NC
–
DESCRIPTION
Data Strobe: Output with read data, input with write data. DQS is
edge-aligned with read data, centered in write data. It is used to
capture data.
No Connect: These pins should be left unconnected.
DNU
RFU
VDDQ
VSSQ
– Do Not Use: Must float to minimize noise.
Reserved for Future Use
Supply DQ Power Supply: Isolated on the die for improved noise
immunity.
Supply DQ Ground. Isolated on the die for improved noise immunity.
VDD Supply Power Supply
VSS Supply Ground.
VREF Supply SSTL_2 reference voltage.
RESERVED NC PINS1
TQFP PIN NUMBERS
37
44
52
SYMBOL
A11
A12
NC (MCL)
TYPE
I
I
DESCRIPTION
Address input for 128Mb and 256Mb devices.
Address input for 256Mb devices. Not Finalized
No Connect: Not internally connected. Must Connect LOW (for
compatibility with SGRAM devices).
NOTE: 1. NC pins not listed may also be reserved for other uses now or in the future. This table simply defines specific NC pins
deemed to be of importance.
64Mb: x32 DDR SDRAM
2M32DDR-07.p65 – Rev. 12/01
6
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001, Micron Technology, Inc.