MT4C4001JCZ-12/883C View Datasheet(PDF) - Micross Components
Part Name
Description
MFG CO.
'MT4C4001JCZ-12/883C' PDF : 21 Pages View PDF
DRAM
MT4C4001J
MECHANICAL DEFINITION*
Micross Case #504 (Package Designator ECJ)
NOTE: The Difference between the ECJ & ECJA packages is that the ECJA has different lead
attach with 5% Sn / 95% Pb solder connection whereas the ECJ package uses compression
weld lead attach. Both package’s lead material is JEDEC TYPE MO-110 option A ‘J’ Form
Copper material.
SYMBOL
A
A1
b
b1
b2
D
D1
E
E1
e
L
*All measurements are in inches.
MT4C4001J
Rev. 2.3 03/10
MICROSS SPECIFICATIONS
MIN
MAX
0.12
0.14
0.035 TYP
0.012 DIA
0.016 DIA
0.050 TYP
0.09
0.110
0.665
0.685
0.592
0.608
0.345
0.355
0.300
0.315
0.045
0.055
0.055
0.065
17
Micross Components reserves the right to change products or specifications without notice.
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