MT55L256L36PF-7.5 View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT55L256L36PF-7.5' PDF : 30 Pages View PDF
8Mb: 512K x 18, 256K x 32/36
PIPELINED ZBT SRAM
BGA PIN DESCRIPTIONS (continued)
x18
x32/x36 SYMBOL TYPE
DESCRIPTION
4F
4F
OE# Input Output Enable: This active LOW, asynchronous input enables the
data I/O output drivers.
4B
4B
ADV#/LD# Input Synchronous Address Advance/Load: When HIGH, this input is
used to advance the internal burst counter, controlling burst
access after the external addressis loaded. When ADV#/LD# is
HIGH, R/W# is ignored. A LOW on ADV#/LD# clocks a new
address at the CLK rising edge.
3R
3R
MODE Input Mode: This input selects the burst sequence. A LOW on this
input selects “linear burst.” NC or HIGH on this input selects
“interleaved burst.” Do not alter input state while device is
operating.
4A
4A
N F Input No Function: These pins are internally connected to the die and
will have the capacitance of input pins. It is allowable to leave
these pins unconnected or driven by signals. These pins are
reserved for address expansion; 4A becomes an SA at 16Mb
density.
(a) 6F, 6H, 6L, (a) 6K, 6L,
6N, 7E, 7G, 6M, 6N, 7K,
7K, 7P
7L, 7N, 7P
(b) 1D, 1H, (b) 6E, 6F,
1L, 1N, 2E, 6G, 6H, 7D,
2G, 2K, 2M 7E, 7G, 7H
(c) 1D, 1E,
1G, 1H, 2E,
2F, 2G, 2H
(d) 1K, 1L,
1N, 1P, 2K,
2L, 2M, 2N
DQa
DQb
Input/ SRAM Data I/Os: For the x18 version, Byte “a” is DQa’s; Byte “b”
Output is DQb’s. For the x32 and x36 versions, Byte “a” is DQa’s;
Byte “b” is DQb’s; Byte “c” is DQc’s; Byte “d” is DQd’s. Input
data must meet setup and hold times around the rising edge of
CLK.
DQc
DQd
6D
6P
NF/DQPa NF/ No Function/Parity Data I/Os: On the x32 version, these are No
2P
6D
NF/DQPb I/O Function (NF). On the x18 version, Byte “a” parity is DQPa; Byte
–
2D
NF/DQPc
“b” parity is DQPb. On the x36 version, Byte “a” parity is DQPa;
–
2P
NF/DQPd
Byte “b” parity is DQPb; Byte “c” parity is DQPc; Byte “d” parity
is DQPd.
2J, 4C, 4J,
4R, 5R, 6J
2J, 4C, 4J,
4R, 5R, 6J
VDD Supply Power Supply: See DC Electrical Characteristics and Operating
Conditions for range.
1A, 1F, 1J,
1M, 1U, 7A,
7F, 7J, 7M,
7U
1A, 1F, 1J,
1M, 1U, 7A,
7F, 7J, 7M,
7U
VDDQ Supply Isolated Output Buffer Supply: See DC Electrical Characteristics
and Operating Conditions for range.
(continued on next page)
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
MT55L512L18P_2.p65 – Rev. 6/01
14
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001, Micron Technology, Inc.
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