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MT8889C View Datasheet(PDF) - Zarlink Semiconductor Inc

Part Name
Description
MFG CO.
'MT8889C' PDF : 31 Pages View PDF
Pin 1
L
Package Outlines
E
A
C
H
e
D
A2
A1
Notes:
1) Not to scale
2) Dimensions in inches
3) (Dimensions in millimeters)
4) Ref. JEDEC Standard M0-150/M0118 for 48 Pin
5) A & B Maximum dimensions include allowable mold flash
B
20-Pin
Dim
Min Max
A
0.079
(2)
A1 0.002
(0.05)
B 0.0087 0.013
(0.22) (0.33)
C
0.008
(0.21)
D 0.27 0.295
(6.9) (7.5)
E
0.2
0.22
(5.0) (5.6)
e
0.025 BSC
(0.635 BSC)
A2 0.065 0.073
(1.65) (1.85)
H 0.29 0.32
(7.4) (8.2)
L 0.022 0.037
(0.55) (0.95)
24-Pin
Min Max
-
0.079
(2)
0.002
(0.05)
0.0087 0.013
(0.22) (0.33)
0.008
(0.21)
0.31
(7.9)
0.33
(8.5)
0.2
(5.0)
0.22
(5.6)
0.025 BSC
(0.635 BSC)
0.065 0.073
(1.65) (1.85)
0.29
(7.4)
0.32
(8.2)
0.022 0.037
(0.55) (0.95)
28-Pin
Min Max
0.079
(2)
0.002
(0.05)
0.0087 0.013
(0.22) (0.33)
0.008
(0.21)
0.39
(9.9)
0.42
(10.5)
0.2
(5.0)
0.22
(5.6)
0.025 BSC
(0.635 BSC)
0.065 0.073
(1.65) (1.85)
0.29
(7.4)
0.32
(8.2)
0.022 0.037
(0.55) (0.95)
48-Pin
Min Max
0.095 0.110
(2.41) (2.79)
0.008 0.016
(0.2) (0.406)
0.008 0.0135
(0.2) (0.342)
0.010
(0.25)
0.62 0.63
(15.75) (16.00)
0.291 0.299
(7.39) (7.59)
0.025 BSC
(0.635 BSC)
0.089 0.099
(2.26) (2.52)
0.395 0.42
(10.03) (10.67)
0.02 0.04
(0.51) (1.02)
Small Shrink Outline Package (SSOP) - N Suffix
General-11
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