MX25L4005A
Figure 21. Chip Erase (CE) Sequence (Command 60 or C7)
CS#
SCLK
SI
01234567
Command
60 or C7
Note: CE command is 60(hex) or C7(hex).
Figure 22. Deep Power-down (DP) Sequence (Command B9)
CS#
SCLK
SI
01234567
Command
B9
tDP
Stand-by Mode Deep Power-down Mode
Figure 23. Release from Deep Power-down and Read Electronic Signature (RES) Sequence
(Command AB)
CS#
SCLK
SI
SO
0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38
Command
AB
High-Z
3 Dummy Bytes
tRES2
23 22 21
MSB
3210
Electronic Signature Out
76543210
MSB
Deep Power-down Mode
Stand-by Mode
P/N: PM1231
REV. 1.8, JUL. 17, 2008
30