MX25L4005
Figure 21. Chip Erase (CE) Instruction Sequence
CS#
SCLK
SI
01234567
Instruction
Note: CE instruction is 60(hex) or C7(hex).
Figure 22. Deep Power-down (DP) Instruction Sequence
CS#
SCLK
SI
01234567
Instruction
tDP
Stand-by Mode Deep Power-down Mode
Figure 23. Release from Deep Power-down and Read Electronic Signature (RES) Instruction
Sequence and Data-Out Sequence
CS#
SCLK
SI
SO
0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38
Instruction
3 Dummy Bytes
tRES2
High Impedance
23 22 21
MSB
3210
Electronic Signature Out
76543210
MSB
Deep Power-down Mode
Stand-by Mode
P/N: PM1236
REV. 1.1, SEP. 30, 2005
30