NX26F640C View Datasheet(PDF) - NexFlash -> Winbond Electronics
Part Name
Description
MFG CO.
'NX26F640C' PDF : 23 Pages View PDF
NX26F640C
Plastic TSOP - 32-pins
Package Code: T (Type I)
1
EH
N
D
SEATING PLANE
S
A
e
B
A1
L
α
C
Plastic TSOP (T—Type I)
Millimeters
Inches
Symbol Min Max
Min Max
Ref. Std.
No. Leads
32
A
– 1.20
– 0.047
A1
0.05 0.15
0.002 0.005
B
0.17 0.27
0.007 0.009
C
0.10 0.21
0.004 0.008
D
7.90 8.10
0.308 0.316
E
18.30 18.50
0.714 0.722
H
19.80 20.20
0.772 0.788
e
0.50 BSC
0.020 BSC
L
0.50 0.70
0.016 0.024
a
0° 5°
0°
5°
Notes:
1. Controlling dimension: millimeters, unless
otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
flash protrusions and should be measured
from the bottom of the package.
4. Formed leads shall be planar with respect to
one another within 0.004 inches at the
seating plane.
22
NexFlash Technologies, Inc.
PRELIMINARY NXSF020D-0902
09/05/02 ©
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