OP193/OP293
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage1
Input Voltage1
Differential Input Voltage1
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
Rating
±18 V
±18 V
±18 V
Indefinite
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
1 For supply voltages less than ±18 V, the input voltage is limited to the
supply voltage.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type
θJA1
8-Lead SOIC_N (S)
158
θJC
Unit
43
°C/W
1 θJA is specified for the worst-case conditions. θJA is specified for a device
soldered in a circuit board for the SOIC package.
ESD CAUTION
Rev. C | Page 8 of 20