PC82573LSL8JD View Datasheet(PDF) - Intel
Part Name
Description
MFG CO.
'PC82573LSL8JD' PDF : 40 Pages View PDF
82573—Datasheet
Table 20.
NVM Interface Timing Specifications for EEPROM (Sheet 2 of 2)
Symbol
Parameter
tHO
Output hold
time
tDIS
Output disable
time
tWC
Write cycle time
1. 50% duty cycle.
Min
0
Typ
Max
250
10
Units
ns
ns
ms
4.0
4.1
Figure 6.
Package and Pinout Information
This section describes the 82573 physical characteristics and pin-to-signal mapping.
Package Information
The 82573 device is a lead-free 196-pin thin and Fine Pitch Ball Grid Array (TF-BGA)
measuring 15 mm by 15 mm. The nominal ball pitch is 1.0 mm.
82573 Controller TF-BGA Package Ball Pad Dimensions
Detail Area
0.4 mm
Solder Resist Opening
0.55 mm
Metal Diameter
30
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