PCF1171C View Datasheet(PDF) - Philips Electronics

Part Name

Description

MFG CO.

PCF1171C

4-digit LCD car clock

Philips Electronics 

1 2 3 4 5 6 7 8 9 10 Next

Philips Semiconductors

4-digit LCD car clock

CHIP DIMENSIONS AND BONDING PAD LOCATIONS

Product specification

PCF1171C

y

F4

G4

B3

A3

F3

G3

2.66 mm

P1, P2

P3, P4

B2

A2

F2

0

G2

0

PCF1171CU

C4

D4

E4

C3

D3

E3

C2

D2

E2

C1

ADEG1

x

2.36 mm

MSA983

Chip area: 6.28 mm2.

Bonding pad dimensions: 110 µm × 110 µm.

Chip thickness: 381 ±25 µm.

Fig.4 Bonding pad locations, PCF1171CU; 40 terminals.

1997 Apr 16

7

Share Link: