PCF1172C View Datasheet(PDF) - Philips Electronics

Part Name

Description

MFG CO.

PCF1172C

3 1/2-digit LCD car clock

Philips Electronics 

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Philips Semiconductors

31/2-digit LCD car clock

CHIP DIMENSIONS AND BONDING PAD LOCATIONS

Product specification

PCF1172C

y

F4

G4

B3

A3

F3

G3

2.66 mm

P1, P2

P3, P4

B2

A2

F2

0

G2

0

PCF1172CU

C4

D4

E4

C3

D3

E3

C2

D2

E2

AM

PM

x

2.36 mm

MSA988

n.c. = not connected.

Chip area: 6.28 mm2.

Bonding pad dimensions: 110 µm × 110 µm.

Chip thickness: 381 ±25 µm.

Fig.4 Bonding pad locations, PCF1172CU; 40 terminals.

1997 Apr 16

7

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