PCF1174C View Datasheet(PDF) - Philips Electronics
Part Name
Description
MFG CO.
'PCF1174C' PDF : 20 Pages View PDF
Philips Semiconductors
4-digit static LCD car clock
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
Product specification
PCF1174C
y
C1
E2
D2
C2
E3
C3
3.02 mm
E4
D4
C4
B4
S1
DATA
0
0
PCF1174CU
B2
COL
G3
F3
AD3
B3
G4
F4
A4
S2
SEL
FLASH
x
2.12 mm
MSA998
Chip area: 6.4 mm2.
Bonding pad dimensions: 110 µm × 110 µm.
Chip thickness: 381 ±25 mm.
Fig.7 Bonding pad locations, PCF1174CU; 40 terminals.
1997 Apr 16
11
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