PCF2123U/5GA/1 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCF2123U/5GA/1' PDF : 63 Pages View PDF
NXP Semiconductors
21. Footprint information for reflow soldering
Footprint information for reflow soldering of HVQFN16 package
PCF2123
SPI Real time clock/calendar
SOT758-1
(0.105)
Hy Gy
Hx
Gx
D
P
0.025
0.025
C
nSPx
nSPy
SPx
SPy
SLy By Ay
SPx tot
SLx
Bx
Ax
solder land
solder paste deposit
solder land plus solder paste
occupied area
nSPx nSPy
2
2
Dimensions in mm
P
Ax
Ay
Bx
By
C
D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hx Hy
0.50 4.00 4.00 2.20 2.20 0.90 0.24 1.50 1.50 0.90
Issue date
12-03-07
12-03-08
0.90
0.30
0.30
3.30
3.30
4.25
4.25
sot758-1_fr
Fig 40. Footprint information for reflow soldering of SOT758-1 (HVQFN16) package of PCF2123BS/1
PCF2123
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 15 July 2013
© NXP B.V. 2013. All rights reserved.
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