PCF212AA View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCF212AA' PDF : 63 Pages View PDF
NXP Semiconductors
20. Footprint information for reflow soldering
PCF2123
SPI Real time clock/calendar
Footprint information for reflow soldering of HVQFN16 package
D
C
(0.105)
Hx
Gx
P
nSPx
Hy Gy
nSPy
0.025
SPx
SPy
SOT758-1
0.025
SLy By Ay
SPx tot
solder land
SLx
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder paste deposit
solder land plus solder paste
occupied area
nSPx nSPy
1
1
Dimensions in mm
P
Ax
Ay
Bx
By
C
D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hx Hy
0.500 4.000 4.000
Issue date
07-05-07
09-06-15
2.200
2.200
0.900
0.240
1.500
1.500
0.650
0.650 0.650 0.650 3.300 3.300 4.250 4.250
sot758-1_fr
Fig 40. Footprint information for reflow soldering of SOT758-1 (HVQFN16) package of PCF2123BS/1
PCF2123
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 27 April 2011
© NXP B.V. 2011. All rights reserved.
57 of 63
Share Link: 
