PCF8531U/2DA/1 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCF8531U/2DA/1' PDF : 51 Pages View PDF
NXP Semiconductors
PCF8531
34 x 128 pixel matrix driver
PCF8531
Product data sheet
Table 5. Bonding pad description …continued
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see Figure 2).
Symbol
Pad
X (μm) Y (μm) Description
C106
210
3103.6 −821.7 LCD column driver output
C107
211
3173.6 −821.7
C108
212
3243.6 −821.7
C109
213
3313.6 −821.7
C110
214
3383.6 −821.7
C111
215
3453.6 −821.7
C112
216
3523.6 −821.7
C113
217
3593.6 −821.7
C114
218
3663.6 −821.7
C115
219
3733.6 −821.7
C116
220
3803.6 −821.7
C117
221
3873.6 −821.7
C118
222
3943.6 −821.7
C119
223
4013.6 −821.7
C120
224
4083.6 −821.7
C121
225
4153.6 −821.7
C122
226
4223.6 −821.7
C123
227
4293.6 −821.7
C124
228
4363.6 −821.7
C125
229
4433.6 −821.7
C126
230
4503.6 −821.7
C127
231
4573.6 −821.7
R33
232
4713.6 −821.7 LCD row driver output; icon row
R31
233
4783.6 −821.7 LCD row driver output
R29
234
4853.6 −821.7
R27
235
4923.6 −821.7
R25
236
4993.6 −821.7
R23
237
5063.6 −821.7
R21
238
5113.6 −821.7
R19
239
5203.6 −821.7
R17
240
5343.6 −821.7
R15
241
5413.6 −821.7
R13
242
5483.6 −821.7
R11
243
5553.6 −821.7
R9
244
5623.6 −821.7
R7
245
5693.6 −821.7
R5
246
5763.6 −821.7
R3
247
5833.6 −821.7
R1
248
5903.6 −821.7
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 May 2011
© NXP B.V. 2011. All rights reserved.
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