PCF8563BS/4 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCF8563BS/4' PDF : 45 Pages View PDF
NXP Semiconductors
15. Package outline
PCF8563
Real-time clock/calendar
HVSON10: plastic thermal enhanced very thin small outline package; no leads;
10 terminals; body 3 x 3 x 0.85 mm
SOT650-1
0
1
2 mm
scale
X
D
BA
terminal 1
index area
A
E
A1
c
detail X
terminal 1
index area
L
e
1
e1
b
5
vMC A B
wM C
y1 C
C
y
Eh
10
6
Dh
DIMENSIONS (mm are the original dimensions)
UNIT A(1)
max.
A1
b
c
D(1) Dh E(1) Eh
e
e1
mm
1
0.05 0.30
0.00 0.18
0.2
3.1
2.9
2.55
2.15
3.1
2.9
1.75
1.45
0.5
2
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT650-1
---
MO-229
---
L
0.55
0.30
v
wy
y1
0.1 0.05 0.05 0.1
EUROPEAN
PROJECTION
ISSUE DATE
01-01-22
02-02-08
Fig 30. Package outline SOT650-1 (HVSON10) of PCF8563BS
PCF8563
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 16 June 2011
© NXP B.V. 2011. All rights reserved.
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