PCF8566 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCF8566' PDF : 48 Pages View PDF
NXP Semiconductors
PCF8566
Universal LCD driver for low multiplex rates
Table 22. Bonding pad description …continued
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see Figure 31).
Symbol
Pad
X (µm) Y (µm) Description
S21
38
−630
−1235
S22
39
−430
−1235
S23
40
−230
−1235
REF
F
REF
C1
REF
Fig 32. Alignment marks
C2
001aai300
Table 23.
Symbol
C1
C2
F
Alignment marks
X (µm)
1100
325
−790
Y (µm)
1090
−625
700
16. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
17. Packing information
Tray information for the PCF8566U is shown in Figure 33, Figure 35 and Table 24.
PCF8566_7
Product data sheet
Rev. 07 — 25 February 2009
© NXP B.V. 2009. All rights reserved.
41 of 48
Share Link: 
