PCF8577CU/10/F3 View Datasheet(PDF) - Philips Electronics
Part Name
Description
MFG CO.
'PCF8577CU/10/F3' PDF : 28 Pages View PDF
Philips Semiconductors
LCD direct/duplex driver with
I2C-bus interface
13 CHIP DIMENSIONS AND BONDING PAD LOCATIONS
handbook, full pagewidth
5
4 3 2 1 40 39 38 37 36
S27 6
S26 7
35 VDD
34 A2/BP2
S25 8
33 BP1
S24 9
32 S1
2.31 S23 10
mm S22 11
S21 12
S20 13
S19 14
x
0
0
y
PCF8577C
31 S2
30 S3
29 S4
28 S5
27 S6
S18 15
26 S7
16 17 18 19 20 21 22 23 24 25
Chip area = 4.62 mm2.
Thickness = 381 ±25 µm.
n-substrate (back) connected to VDD.
Bonding pad dimensions = 110 µm × 110 µm.
2 mm
MGA726
Fig.18 Bonding pad locations.
Product specification
PCF8577C
handbook, halfpage
1998 Jul 30
MBE924
Fig.19 Reference marks.
19
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