PCF8801 View Datasheet(PDF) - Philips Electronics
Part Name
Description
MFG CO.
'PCF8801' PDF : 20 Pages View PDF
Philips Semiconductors
LCD driver for 140 Γ 2 segments
Product speciο¬cation
PCF8801
BONDING PAD INFORMATION
The PCF8801 is manufactured using n-well CMOS
technology.
Table 5 Bonding pad locations
All x/y coordinates represent the position of the centre of
each pad (in Β΅m) with respect to the centre (x/y = 0) of the
chip (see Fig.6).
SYMBOL
VSS3
VSS4
VDD3
VDD4
LDP2
LDN2
DI2
DO2
CLK2
REXT
OSC2
INT_OSCO2
T1
RESET
VSS5
VDD5
T2
T3
DIR
INT_OSCO1
OSC1
CLK1
DO1
DI1
LDN1
LDP1
VDD2
VDD1
VSS2
VSS1
COM1_1
COM2_1
PAD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
COORDINATES
x
y
β5644.4
β5644.4
β5644.4
β5644.4
β5644.4
β5644.4
β5644.4
β5644.4
β5644.4
β5238.3
β5138.3
β5038.3
β4913.3
β134.6
β47.1
53.4
4791.2
4916.2
5041.2
5141.2
5241.2
5644.4
5644.4
5644.4
5644.4
5644.4
5644.4
5644.4
5644.4
5644.4
5401.7
5326.7
382.4
307.4
232.4
157.4
82.4
β15.0
β115.0
β215.0
β315.0
β439.4
β439.4
β439.4
β439.4
β439.4
β439.4
β439.4
β439.4
β439.4
β439.4
β439.4
β439.4
β314.9
β214.9
β114.9
β14.9
83.4
158.4
233.4
308.4
383.4
440.0
440.0
SYMBOL
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
S15
S16
S17
S18
S19
S20
S21
S22
S23
S24
S25
S26
S27
S28
S29
S30
S31
S32
S33
S34
S35
S36
S37
S38
S39
PAD
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
COORDINATES
x
y
5251.7
5176.7
5101.7
5026.7
4951.7
4876.7
4801.7
4726.7
4651.7
4576.7
4501.7
4426.7
4351.7
4276.7
4201.7
4126.7
4051.7
3976.7
3901.7
3826.7
3751.7
3676.7
3601.7
3526.7
3451.7
3376.7
3301.7
3226.7
3151.7
3076.7
3001.7
2926.7
2851.7
2776.7
2701.7
2626.7
2551.7
2476.7
2401.7
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
440.0
2000 Feb 04
12
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