PCK942C View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'PCK942C' PDF : 11 Pages View PDF
Philips Semiconductors
PCK942C
Low voltage 1 : 18 clock distribution chip
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
12. Abbreviations
Table 10: Abbreviations
Acronym
Description
LVCMOS
Low Voltage Complementary Metal Oxide Silicon
LVPECL
Low Voltage Positive Emitter Coupled Logic
LVTTL
Low Voltage Transistor-Transistor Logic
13. Revision history
Table 11: Revision history
Document ID
Release date Data sheet status
PCK942C_1
20060215
Product data sheet
Change notice Doc. number
-
-
Supersedes
-
PCK942C_1
Product data sheet
Rev. 01 — 15 February 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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