PF38F1602CT70 View Datasheet(PDF) - Intel
Part Name
Description
MFG CO.
'PF38F1602CT70' PDF : 75 Pages View PDF
C3 SCSP Flash Memory
Appendix F Mechanical and Shipping Media Details
F.8
Mechanical Specification
A1
Index
1234567
A
8 9 10 11 12
B
C
E
D
E
F
G
H
D
Top View - Ball Down
A2
S2
12 11 10 9 8
7654321
A
B
C
D
E
F
G
H
e
S1
b
Bottom View - Ball Up
A
Y
A1
Note: Shaded pins indicate upper address balls for 64-Mbit and 128-Mbit devices. In all Flash and SRAM
combinations, 66 balls are populated on lower density devices. (Upper address balls are not populated).
Table 35. Packaging Specifications (0.18µm and 0.25µm) (Sheet 1 of 2)
Millimeters
Inches
Package Height
Ball Height
Package Body Thickness
Ball Lead Diameter
Package Body Length – 16-Mbit/2-Mbit
Package Body Length –
32-Mbit/4-Mbit, 16-Mbit/4-Mbit
Package Body Length –
32-Mbit/8-Mbit
Package Body Width –
16-Mbit/2-Mbit, 16-Mbit/4-Mbit,
32-Mbit/4-Mbit, 32-Mbit/8-Mbit
Sym
A
A1
A2
b
D
Min
0.250
0.350
9.900
Nom
0.960
0.400
10.00
Max
1. 400
0.450
10.100
Min
0.0098
0.0138
0.3898
Nom
0.0378
0.0157
0.3937
Max
0.0551
0.0177
0.3976
11.900 12.000 12.100 0.4685 0.4724 0.4764
13.900 14.000 14.100 0.5472 0.5512 0.5551
E
7.900 8.000 8.100 0.3110 0.3150 0.3189
26 Aug 2005
68
Intel® Advanced+ Boot Block Flash Memory (C3) SCSP Family
Order Number: 252636, Revision: 004
Datasheet
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