Packaging Mechanical: 16-Pin TSSOP (L)
16
.169 4.3
.177 4.5
1
.193
.201
4.9
5.1
.0256
BSC
0.65
.007
.012
0.19
0.30
.047
max.
1.20
SEATING
PLANE
.002 0.05
.006 0.15
Note:
1. Package Outline Exclusive of Mold Flash and Metal Burr
2. Controlling dimentions in millimeters
3. Ref: JEDEC MO-153F/AB
PI49FCT20802/PI49FCT20803
1:5/1:7 2.5V Clock Buffer for
Networking Applications
DOCUMENT CONTROL NO.
PD - 1310
REVISION: E
DATE: 03/09/05
0.45 .018
0.75 .030
.252
BSC
6.4
.004 0.09
.008 0.20
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2335 • www.pericom.com
DESCRIPTION: 16-Pin, 173-Mil Wide, TSSOP
PACKAGE CODE: L
11-0004
6
www.pericom.com
P-0.1
01/24/11