PIC16C505T-20I/SL View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
'PIC16C505T-20I/SL' PDF : 85 Pages View PDF
11.0 PACKAGING INFORMATION
11.1 Package Marking Information
14-Lead PDIP (300 mil)
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
AABBCDE
14-Lead SOIC (150 mil)
XXXXXXXXXX
AABBCDE
14-Lead Windowed Ceramic (300 mil)
XXX
XXXXXX
PIC16C505
Example
16C505-04I/P
BUILT 4 SPEED
9904SAZ
Example
16C505-04I
9904SAZ
Example
JW
16C505
Legend: MM...M
XX...X
AA
BB
C
D
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Note: In the event the full Microchip part number cannot be marked on one line,
it will be carried over to the next line thus limiting the number of available
characters for customer specific information.
* Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
© 1999 Microchip Technology Inc.
DS40192C-page 75
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