PIC16LC554-I/L View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
'PIC16LC554-I/L' PDF : 108 Pages View PDF
PIC16C55X
28-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E1
W2
D
n
c
2
1
W1
E
A
eB
A1
Units
Dimension Limits
Number of Pins
n
Pitch
p
Top to Seating Plane
A
Ceramic Package Height
A2
Standoff
A1
Shoulder to Shoulder Width
E
Ceramic Pkg. Width
E1
Overall Length
D
Tip to Seating Plane
L
Lead Thickness
c
Upper Lead Width
B1
Lower Lead Width
B
Overall Row Spacing
§
eB
Window Width
W1
Window Length
W2
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-058
Drawing No. C04-080
MIN
.170
.155
.015
.300
.285
1.430
.135
.008
.050
.016
.345
.130
.290
INCHES*
NOM
28
.100
.183
.160
.023
.313
.290
1.458
.140
.010
.058
.019
.385
.140
.300
B1
B
MAX
.195
.165
.030
.325
.295
1.485
.145
.012
.065
.021
.425
.150
.310
A2
L
p
MILLIMETERS
MIN
NOM
28
2.54
4.32
4.64
3.94
4.06
0.38
0.57
7.62
7.94
7.24
7.37
36.32
37.02
3.43
3.56
0.20
0.25
1.27
1.46
0.41
0.47
8.76
9.78
3.30
3.56
7.37
7.62
MAX
4.95
4.19
0.76
8.26
7.49
37.72
3.68
0.30
1.65
0.53
10.80
3.81
7.87
DS40143E-page 94
Preliminary
1996-2013 Microchip Technology Inc.
Share Link: 
