PS2581L1 View Datasheet(PDF) - NEC => Renesas Technology
Part Name
Description
MFG CO.
'PS2581L1' PDF : 12 Pages View PDF
PS2581L1,PS2581L2
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
235 °C (package surface temperature)
• Time of temperature higher than 210 °C 30 seconds or less
• Number of reflows
Three
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
120 to 160 ˚C
60 to 90 s
(preheating)
(heating)
to 10 s
to 30 s
235 ˚C (peak temperature)
210 ˚C
Time (s)
Caution Avoid removing the residual flux with chlorine-based cleaning solvent after a reflow process.
Peak temperature 235 ˚C or below
(2) Dip soldering
• Temperature
• Time
• Number of times
• Flux
260 °C or below (molten solder temperature)
10 seconds or less
One
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
8
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