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RF2161PCBA View Datasheet(PDF) - RF Micro Devices

Part Name
Description
MFG CO.
'RF2161PCBA' PDF : 8 Pages View PDF
1 2 3 4 5 6 7 8
RF2161
Preliminary
Pin
Pkg
Base
Function
GND
Description
Ground connection. The backside of the package should be soldered
to a top side ground pad which is connected to the ground plane with
multiple vias. The pad should have a short thermal path to the ground
plane.
Interface Schematic
2
2-200
Rev A3 010514
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