RF2314PCBA View Datasheet(PDF) - RF Micro Devices
Part Name
Description
MFG CO.
'RF2314PCBA' PDF : 10 Pages View PDF
RF2314
PCB Design Requirements
PCB Surface Finish
The PCB surface finish used for RFMD’s qualification process is Electroless Nickel, immersion Gold. Typical thickness is
3μinch to 8μinch Gold over 180μinch Nickel.
PCB Land Pattern Recommendation
PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.
PCB Metal Land Pattern
Pin 1
0.95 (mm)
Typ.
A = 0.70 x 1.00 (mm) Typ.
A
A
A
Pin 5
1.90 (mm)
Typ.
A
A
2.60 (mm)
Figure 1. PCB Metal Land Pattern (Top View)
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance
can be provided in the master data or requested from the PCB fabrication supplier.
A = 0.90 x 1.20 (mm) Typ.
A
0.95 (mm)
Typ.
A
A
1.90 (mm)
Typ.
A
A
Figure 2. PCB Solder Mask Pattern (Top View)
2.60 (mm)
Rev A6 051025
4-219
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