RF2361PCBA-L View Datasheet(PDF) - RF Micro Devices
Part Name
Description
MFG CO.
'RF2361PCBA-L' PDF : 14 Pages View PDF
RF2361
PCB Solder Mask Pattern
Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB
metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The
center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be
provided in the master data or requested from the PCB fabrication supplier.
Pin 1
A = 0.90 x 1.20 (mm) Typ.
Dimensions in mm.
Pin 5
A
0.95 Typ.
A
A
1.90 Typ.
A
A
2.60
Figure 2. PCB Solder Mask (Top View)
RoHS* Banned Material Content
RoHS Compliant:
Package total weight in gram
Compliance Date Code:
Bill of Materials Revision:
Pb Free Category:
No
0.015
N/A
Rev-
Contains Pb
Bill of Materials
Die
Molding Compound
Lead Frame
Die Attach Epoxy
Wire
Solder Plating
Pb
0
0
0
0
0
4753
Parts Per Million (PPM)
Cd
Hg
Cr VI
PBB
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
PBDE
0
0
0
0
0
0
This RoHS banned material content declaration was prepared solely on information, including analytical
data, provided to RFMD by its suppliers, and applies to the Bill of Materials (BOM) revision noted
* DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the
use of certain hazardous substances in electrical and electronic equipment
Rev A10 DS070731
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
13 of 14
Share Link: 
